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Intel Mobile Pentium II KP 400/256

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To reduce costs and provide a more easy way for processor upgrades, the mobile modules were superseded by just the processors packed in small packages. The BGA (Ball Grid Array) was introduced for mobile CPUs and in low-cost notebooks these BGA processors were soldered directly on the mainboard. To make a notebook upgradeable, the BGA processors had to be mounted on adaptors to fit into standardized micro-sockets on notebook mainboards. This CPUs use a BGA package and is soldered on a small PCB with pins to fit into a standard notebook socket. The complete package is called Micro-PGA1 and has 615 pins (243 of them are not connected).

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Core Frequency:	400 MHz
Board Frequency:	66 MHz
Clock Multiplier:	6.0
Data bus (ext.):	64 Bit
Address bus:	36 Bit
Transistors:	27,400,000
Circuit Size:	0.18 µ
Core / I/O Voltage:	1.55 / 3.3 V
Introduced:	June 14, 1999
Manufactured:	week 49/1999
L1 Cache:	16+16 KB
L2 Cache:	256 KB
Intel S-Spec:	SL3BW
Package Type:	Plastic Micro-PGA1-615

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