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  VIA Cyrix III-750A MHz, Engineering Sample
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VIA Cyrix III-750A MHz, Engineering Sample
VIA Cyrix III-750A MHz, Engineering Sample Top Side
VIA Cyrix III Processor
VIA Cyrix III-750AMHz
(100 x 7.5)
HEATSINK/FAN REQUIRED
VIA Cyrix III-750A MHz, Engineering Sample Back Side
C5B ES
Lot#CE2133.C5
Wafer#19
BIN#3
1.7V/100
By 2001, the Samuel 2 (C5B) was released, this time just as the VIA C3. Samuel 2 ran at a higher clock speed and added a level 2 cache, required lower voltage and was also available in an Enhanced Ball Grid Array (EBGA) version. EBGA allowed the CPU to be mounted directly onto a motherboard without using Intel's costly Socket 370.
 
This is a Samuel 2 Engineering Sample, still marked Cyrix III and in PGA package.
 
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Core Frequency:750 MHz
Board Frequency:100 MHz
Clock Multiplier:7.5
Data bus (ext.):64 Bit
Address bus:32 Bit
Transistors:15,200,000
Circuit Size:0.15
Voltage:1.7 V
Introduced:May 28, 2001
L1 Cache:64+64 KB
L2 Cache:64 KB
CPU Code:Samuel 2
C5B
Package Type:Ceramic
PGA-370
Socket: 370
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VIA C3-750A MHz, Engineering Sample
VIA C3-750A MHz, Engineering Sample Top Side
C3 Processor
VIA C3-750AMHz
(100 x 7.5)
HEATSINK/FAN REQUIRED
VIA C3-750A MHz, Engineering Sample Back Side
(C)(M) VIA C3 ES
750MHz (100X7.5)
1.6V AF40JRO
0136 TAIWAN
10625G1
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Core Frequency:750 MHz
Board Frequency:100 MHz
Clock Multiplier:7.5
Data bus (ext.):64 Bit
Address bus:32 Bit
Transistors:15,200,000
Circuit Size:0.25
Voltage:1.6 V
Introduced:May 28, 2001
Manufactured:week 36/2001
Made in:Taiwan
L1 Cache:64+64 KB
L2 Cache:64 KB
CPU Code:Samuel 2
C5B
Package Type:Plastic
BGA-336
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