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Sun Microsystems UltraSPARC III
  Sun Microsystems UltraSPARC III SME 1052A
  Sun Microsystems UltraSPARC III SME 1052B, 900 MHz
  Sun Microsystems UltraSPARC III SME 1052B, 1015 MHz
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The Sun UltraSPARC III Processor
Sun UltraSPARC III
The UltraSPARC III, initially shipped in 2001, is the third generation from the UltraSPARC family. It features Scalable Shared Memory (SSM) and is able to scale to up to 1000 processors in a single system.
 
It was one of the most complex processors available then, comprising 29 million transistors and features such as an embedded memory controller and 9.6 GB-per-second address bus for massive scalability, support for a large 8 MB ECC-protected external cache for minimal latency and a new error isolation and correction "Uptime Bus" (a bus that runs independent of the main system bus, allowing the CPU to be powered-on, configured and tested without requiring that the majority of the system be operational) for high system reliability.
 
The UltraSPARC III was Sun's first move to boost its aging chip architecture after almost five years. The chip was due 18 months before its introduction, but was delayed for reasons never explained.
 
The initial version of UltraSPARC III was fabricated by Texas Instruments in a 0.18 process technology with aluminum (Al) metal layers. Implemented in this technology, UltraSPARC III operates at frequencies of 600 MHz and 750 MHz. In 2001, UltraSPARC III was upgraded to take advantage of a new TI process technology featuring 0.15 features with Copper (Cu) metal layers. Implemented in this more advanced generation of technology, UltraSPARC III operates at frequencies of 900 and 1050 MHz. In 2002, UltraSPARC III Cu was upgraded again to TIs latest 0.13 generation of technology, reaching a top operating frequency of 1200 MHz.
 
References:  UltraSPARC III announcement  UltraSPARC III at Sun
Sun Microsystems UltraSPARC III SME 1052A
Sun Microsystems UltraSPARC III SME 1052A Top Side
Sun
(C)(M)1999,SMI
UltraSPARC III
D1031806 0108
PG1.1 980 USA
SME 1052A LGA
Sun Microsystems UltraSPARC III SME 1052A Back Side
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Data bus (ext.):64 Bit
Address bus:64 Bit
Transistors:29,000,000
Circuit Size:0.18
Voltage:1.7 V
Introduced:November 2001
Manufactured:week 08/2001
Made in:USA
L1 Cache:32+64 KB
L2 Cache:8 MB ext.
CPU Code:Cheetah
Package Type:Ceramic
Heat Spreader
LGA-1368
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Sun Microsystems UltraSPARC III SME 1052B, 900 MHz
Sun Microsystems UltraSPARC III SME 1052B, 900 MHz Top Side
Sun
(C)(M)1999,SMI
UltraSPARC III
E2629560 0250
PG2.3 980 USA
SME 1052B LGA
1040
-900
BF6
2CAN6TC C00224
Sun Microsystems UltraSPARC III SME 1052B, 900 MHz Back Side
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Core Frequency:900 MHz
Board Frequency:150 MHz
Clock Multiplier:6.0
Data bus (ext.):64 Bit
Address bus:64 Bit
Transistors:29,000,000
Circuit Size:0.15
Voltage:1.7 V
Introduced:November 2001
Manufactured:week 50/2002
Made in:USA
L1 Cache:32+64 KB
L2 Cache:8 MB ext.
CPU Code:Cheetah
Package Type:Ceramic
Heat Spreader
LGA-1368
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Sun Microsystems UltraSPARC III SME 1052B, 1015 MHz
Sun Microsystems UltraSPARC III SME 1052B, 1015 MHz Top Side
Sun
(C)(M)1999,SMI
UltraSPARC III
D1220003 0149
PG2.2 980 USA
SME 1052B LGA
EC
7153
-1015
AEA
Sun Microsystems UltraSPARC III SME 1052B, 1015 MHz Back Side
Donated by Sunopsis, the Sun Museum. Thanks a lot!  
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Core Frequency:1015 MHz
Board Frequency:150 MHz
Data bus (ext.):64 Bit
Address bus:64 Bit
Transistors:29,000,000
Circuit Size:0.15
Voltage:1.7 V
Introduced:November 2001
Manufactured:week 49/2001
Made in:USA
L1 Cache:32+64 KB
L2 Cache:8 MB ext.
CPU Code:Cheetah
Package Type:Ceramic
Heat Spreader
LGA-1368
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